White Paper | April 2025
Challenges in the processing of high-viscosity 2K adhesives with a manual dispenser
Author: Dipl.-Ing. Wolfgang Wulff, Head of Application Engineering • European Adhesive Engineer • European Welding Engineer
DINITROL Compact Push Dispenser
The use of 1K moisture curing adhesives is limited when
thick-film bonding with a high adhesive content is
required. This is due to the fact that the moisture must dif-
fuse from the outside to the inside in order for the adhesive
to cure. The curing speed decreases with increasing curing,
which means long service lives until the adhesive bond can
be fully stressed. If the accessibility of air humidity through
narrow gaps (ratio of gap width to depth) is small and only
on one side, it can happen that an adhesive in the core
does not cure at all. In these cases, it is advisable to use a
2-component adhesive that is independent of air humid-
ity. A secure bond is achieved in a defined time and
downtimes are reduced.
The processing of 2 components and their homogeneous
mixing is somewhat more complicated. This article describes
the challenges and problem solutions in the development
of the DINITROL 2K COMPACT PUSH DISPENSER
You can download the complete white paper here as a PDF:
